一、综合词汇

1、印制电路：printed circuit
2、印制线路：printed wiring
3、印制板：printed board
4、印制板电路：printed circuit board (PCB)
5、印制线路板：printed wiring board(PWB)
6、印制元件：printed component
7、印制接点：printed contact
8、印制板装配：printed board assembly

9、板：board
10、单面印制板：single-sided printed board(SSB)
11、双面印制板：double-sided printed board(DSB)
12、多层印制板：mulitlayer printed board(MLB)
13、多层印制电路板：mulitlayer printed circuit board
14、多层印制线路板：mulitlayer prited wiring board

15、刚性印制板：rigid printed board

16、挠性印制板：flexible printed board

17、金属芯印制板：metal core printed board

18、金属基印制板：metal base printed board
19、多重布线印制板：mulit-wiring printed board
20、陶瓷印制板：ceramic substrate printed board
21、导电胶印制板：electroconductive paste printed board

22、载芯片板：chip on board (COB)
23、埋电阻板：buried resistance board

24、裸板：bare board

25、板边插头：edge-board contact
26、增强板：stiffener
27、基底：substrate
28、基板面：real estate
29、导线面：conductor side
30、元件面：component side
31、焊接面：solder side
32、印制：printing
33、网格：grid
34、图形：pattern
35、导电图形：conductive pattern
36、非导电图形：non-conductive pattern
37、字符：legend
38、标志：mark

39、基材：base material

40、层压板：laminate

41、内层芯板：core material

42、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates

43、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates

44、陶瓷基覆铜箔板：ceramics base copper-clad laminates

45、聚酯薄膜：polyester
46、聚酰亚胺薄膜：polyimide film (PI)
47、聚四氟乙烯：polytetrafluoetylene (PTFE)

48、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)

49、导电箔：conductive foil
50、铜箔：copper foil
51、电解铜箔：electrodeposited copper foil (ED copper foil)
52、压延铜箔：rolled copper foil

53、复合金属箔：composite metallic material

54、原理图：shematic diagram
55、逻辑图：logic diagram
56、印制线路布设：printed wire layout
57、布设总图：master drawing

58、计算机辅助制造：computer-aided manufacturing.(CAM)

59、组装设计自动化：assembly aided architectural design. (AAAD)

60、布局：placement
61、布线：routing
62、布图设计：layout

63、模块化：modularization

64、镜像：mirroring

65、逻辑模拟：logic simulation

66、布线完成率：layout effeciency
67、机器描述格式：machine descriptionm format .(MDF)

68、网络表：net List